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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5935-00-931-0014 Item Description: Socket Plug In Electronic Compon | 5935 | 009310014 | 0 | P | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | G | ||||
Part Number | isc | rnvc | rncc | HCC | MSDS | SADC |
18-33wmtgrings | 2 | 1 | C | A |
MRC | Criteria | Characteristic |
---|---|---|
AAFZ | BODY MATERIAL | PLASTIC" |
AAQL | BODY STYLE | TOP MOUNT, PRESS FIT" |
AARN | FABRICATION METHOD | MOLDED" |
ABJH | TEMP RATING | 225.0 DEG CELSIUS" |
ABJT | TERMINAL LENGTH | 0.118 INCHES NOMINAL" |
ABKW | OVERALL HEIGHT | 0.430 INCHES NOMINAL" |
ADAL | BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.252 INCHES NOMINAL" |
ADAV | OVERALL DIAMETER | 0.312 INCHES NOMINAL" |
AEVB | MOUNTING HOLE STYLE | ROUND, FLATTED" |
AFJE | SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE" |
AFRG | CONTACT MATERIAL | BERYLLIUM COPPER" |
AFRH | CONTACT SURFACE TREATMENT | GOLD AND SILVER" |
AFRL | ACCOMMODATED CONTACT QUANTITY | 3" |
AKWN | POLARIZATION TYPE | OFF CENTER HOLE" |
AKXD | PROJECTION LENGTH ABOVE MOUNTING SURFACE | 0.062 INCHES NOMINAL" |
AKXE | DISTANCE FROM FLATTED PORTION TO OPPOSITE SURFACE | 0.232 INCHES NOMINAL" |
AXGY | MOUNTING METHOD | PRESS FIT" |
BCNX | MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS" |
PMLC | PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD AND CONTACT SURFACES SILVER" |
PMWT | PRECIOUS MATERIAL AND WEIGHT | 0.015 GOLD GRAINS, TROY AND 0.015 SILVER GRAINS, TROY" |
PRMT | PRECIOUS MATERIAL | GOLD AND SILVER" |
TTQY | TERMINAL TYPE AND QUANTITY | 3 SOLDER STUD" |
AAFZ | BODY MATERIAL | PLASTIC" |
AAQL | BODY STYLE | TOP MOUNT, PRESS FIT" |
AARN | FABRICATION METHOD | MOLDED" |
ABJH | TEMP RATING | 225.0 DEG CELSIUS" |
ABJT | TERMINAL LENGTH | 0.118 INCHES NOMINAL" |
ABKW | OVERALL HEIGHT | 0.430 INCHES NOMINAL" |
ADAL | BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.252 INCHES NOMINAL" |
ADAV | OVERALL DIAMETER | 0.312 INCHES NOMINAL" |
AEVB | MOUNTING HOLE STYLE | ROUND, FLATTED" |
AFJE | SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE" |
AFRG | CONTACT MATERIAL | BERYLLIUM COPPER" |
AFRH | CONTACT SURFACE TREATMENT | GOLD AND SILVER" |
AFRL | ACCOMMODATED CONTACT QUANTITY | 3" |
AKWN | POLARIZATION TYPE | OFF CENTER HOLE" |
AKXD | PROJECTION LENGTH ABOVE MOUNTING SURFACE | 0.062 INCHES NOMINAL" |
AKXE | DISTANCE FROM FLATTED PORTION TO OPPOSITE SURFACE | 0.232 INCHES NOMINAL" |
AXGY | MOUNTING METHOD | PRESS FIT" |
BCNX | MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS" |
PMLC | PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD AND CONTACT SURFACES SILVER" |
PMWT | PRECIOUS MATERIAL AND WEIGHT | 0.015 GOLD GRAINS, TROY AND 0.015 SILVER GRAINS, TROY" |
PRMT | PRECIOUS MATERIAL | GOLD AND SILVER" |
TTQY | TERMINAL TYPE AND QUANTITY | 3 SOLDER STUD" |
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