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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-440-3238 Item Description: Semiconductor Devices Unitized | 5961 | 014403238 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | isc | rnvc | rncc | HCC | MSDS | SADC |
Sues2608 | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | METAL" |
ABHP | OVERALL LENGTH | 1.573 INCHES MAXIMUM" |
ABKW | OVERALL HEIGHT | 0.450 INCHES MAXIMUM" |
ABMK | OVERALL WIDTH | 1.050 INCHES MAXIMUM" |
AGAV | END ITEM IDENTIFICATION | CASS STATION E/I FSCM 30003" |
AKPV | MOUNTING FACILITY QUANTITY | 2" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-3" |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE" |
AXGY | MOUNTING METHOD | UNTHREADED HOLE" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 600.0 MAXIMUM REVERSE VOLTAGE, PEAK ALL SEMICONDUCTOR DEVICE DIODE AND 1.2 MAXIMUM FORWARD VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 12.50 AMPERES FORWARD CURRENT, AVERAGE ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE AND 200.00 AMPERES FORWARD CURRENT, AVERAGE PRESET ALL SEMICONDUCTOR DEVICE DIODE AND 70.00 MICROAMPERES FORWARD CURRENT, AVERAGE PEAK ALL SEMICONDUCTOR DEVICE D" |
FEAT | SPECIAL FEATURES | DRAWING IAW MIL-S-19500; TEST IAW MIL-STD-750" |
TEST | TEST DATA DOCUMENT | 30003-2037AS785 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DR" |
TTQY | TERMINAL TYPE AND QUANTITY | 2 PIN AND 1 CASE" |
ABBH | INCLOSURE MATERIAL | METAL" |
ABHP | OVERALL LENGTH | 1.573 INCHES MAXIMUM" |
ABKW | OVERALL HEIGHT | 0.450 INCHES MAXIMUM" |
ABMK | OVERALL WIDTH | 1.050 INCHES MAXIMUM" |
AGAV | END ITEM IDENTIFICATION | CASS STATION E/I FSCM 30003" |
AKPV | MOUNTING FACILITY QUANTITY | 2" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-3" |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE" |
AXGY | MOUNTING METHOD | UNTHREADED HOLE" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 600.0 MAXIMUM REVERSE VOLTAGE, PEAK ALL SEMICONDUCTOR DEVICE DIODE AND 1.2 MAXIMUM FORWARD VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 12.50 AMPERES FORWARD CURRENT, AVERAGE ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE AND 200.00 AMPERES FORWARD CURRENT, AVERAGE PRESET ALL SEMICONDUCTOR DEVICE DIODE AND 70.00 MICROAMPERES FORWARD CURRENT, AVERAGE PEAK ALL SEMICONDUCTOR DEVICE D" |
FEAT | SPECIAL FEATURES | DRAWING IAW MIL-S-19500; TEST IAW MIL-STD-750" |
TEST | TEST DATA DOCUMENT | 30003-2037AS785 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DR" |
TTQY | TERMINAL TYPE AND QUANTITY | 2 PIN AND 1 CASE" |
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